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RBO40-40G/m/t a powerso-10 tm rbo40-40m protection against "load dump" pulse 40a diode to guard against battery reversal monolithic structure for greater reliability breakdown voltage : 24 v min. clamping voltage : 40 v max. compliant with iso / dtr 7637 features designed to protect against battery reversal and load dump overvoltages in automotive applica- tions, this monolithic component offers multiple functions in the same package : d1 : reversed battery protection t1 : clamping against negative overvoltages t2 : transil function against "load dump" effect. description functional diagram 1 2 3 reversed battery and overvoltage protection circuit (rbo) application specific discretes a.s.d. tm january 1997 - ed : 3 d 2 pak RBO40-40G to220ab rbo40-40t 1/15
symbol parameter value unit i fsm non repetitive surge peak forward current (diode d1) tp = 10 ms 120 a i f dc forward current (diode d1) tc = 75c 40 a v pp peak load dump voltage (see note 1and 2) 5 pulses (1 minute between each pulse) 80 v p pp peak pulse power between input and output (transil t1) tj initial = 25c 10/1000 m s 1500 w t stg tj storage temperature range maximum junction temperature - 40 to + 150 150 c t l maximum lead temperature for soldering during 10 s at 4.5mm from case for to220ab 260 c note 1 : for a surge greater than the maximum value, the device will fail in short-circuit. note 2 : see load dump curves. tm : powerso-10, transil and asd are trademarks of sgs-thomson microelectronics. absolute maximum ratings symbol parameter value unit rth (j-c) junction to case rbo40-40m RBO40-40G rbo40-40t 1.0 1.0 1.0 c/w rth (j-a) junction to ambient rbo40-40t 60 c/w thermal resistance d1 t1 2 3 1 v cl 31 v rm 31 v f 13 v13 i13 i rm 31 i r 31 ipp31 v br 31 t2 i f i pp 32 v rm 32 v b r 32 v c l 32 3 2 1 v32 i32 i r 32 i rm 32 ex : v f 13 . between pin 1 and pin 3 v br 32 . between pin 3 and pin 2 a RBO40-40G / rbo40-40m / rbo40-40t 2/15
symbol test conditions value unit min. typ. max. v f 13 i f = 40 a 1.9 v v f 13 i f = 20a 1.45 v v f 13 i f = 1 a 1 v v f 13 i f = 100 ma 0.95 v c 13 f = 1mhz v r = 0 v 3000 pf electrical characteristics : diode d1 (- 40c < t amb < + 85c) symbol parameter v rm31 /v rm32 stand-off voltage transil t1 / transil t2. v br31 /v br32 breakdown voltage transil t1 / transil t2. i r31 /i r32 leakage current transil t1 / transil t2. v cl31 /v cl32 clamping voltage transil t1 / transil t2. v f13 forward voltage drop diode d1. i pp peak pulse current. a t temperature coefficient of v br . c 31 /c 32 capacitance transil t1 / transil t2. c 13 capacitance of diode d1 symbol test conditions value unit min. typ. max. v br 31 i r = 1 ma 22 35 v v br 31 i r = 1 ma, t amb = 25c 24 32 v i rm 31 v rm = 20 v 100 m a i rm 31 v rm = 20 v, t amb = 25c 10 m a v cl 31 i pp = 37.5a, tj initial = 25c 10/1000 m s40v a t temperature coefficient of v br 910 -4 / c c 31 f = 1mhz v r = 0 v 3000 pf electrical characteristics : transil t1 (- 40c < t amb < + 85c) symbol test conditions value unit min. typ. max. v br 32 i r = 1 ma 22 35 v v br 32 i r = 1 ma, t amb = 25c 24 32 v i rm 32 v rm = 20 v 100 m a i rm 32 v rm = 20 v, t amb = 25c 10 m a v cl 32 i pp = 20 a (note 1) 40 v a t temperature coefficient of v br 910 -4 / c c 32 f = 1mhz v r = 0 v 8000 pf note 1 : one pulse, see pulse definition in load dump test generator circuit. electrical characteristics : transil t2 (- 40c < t amb < + 85c) a RBO40-40G / rbo40-40m / rbo40-40t 3/15
product description 1 2 3 the rbo has 3 functions integrated on the same chip. d1 : diode function in order to protect against reversed battery operation. t2 : transil function in order to protect against positive surge generated by electric systems (ignition, relay. ...). t1 : protection for motor drive application (see below). basic application * the monolithic multi-function protection (rbo) has been developed to protect sensitive semiconductors in car electronic modules against both overvoltage and battery reverse. * in addition, the rbo circuit prevents overvoltages generated by the module from affecting the car supply network. motor driver application d1 t1 t2 battery rbo device motor control motor filter in this application, one half of the motor drive circuit is supplied through the rbo and is thus protected as per its basic function application. the second part is connected directly to the car supply network and is protected as follows : - for positive surges : t2 (clamping phase) and d1 in forward-biased. - for negative surges : t1 (clamping phase) and t2 in forward-biased. a RBO40-40G / rbo40-40m / rbo40-40t 4/15
- input (1) : pin 1 to 5 - output (3) : pin 6 to 10 - gnd (2) : connected to base tab marking : logo, date code, rbo40-40m pinout configuration in powerso-10 : top view pin 6 pin 1 input (1) gnd (2) t1 d1 ta b t2 output (3) - input (1) : pin 1 - output (3) : pin 3 - gnd (2) : connected to base tab marking : logo, date code, RBO40-40G pinout configuration in d 2 pak : d1 t1 t2 tab d1 t1 t2 (tab) - input (1) : pin 1 - output (3) : pin 3 - gnd (2) : connected to base tab marking : logo, date code, rbo40-40t pinout configuration in to220ab : a RBO40-40G / rbo40-40m / rbo40-40t 5/15
load dump test generator circuit (schaffner nsg 506 c). issued from iso / dtr 7637. u(v) t 0 vbat 90% vs 10% t tr offset 10% / 13.5v open circuit (voltage curve) (pulse test n5) corresponding current wave with d.u.t. ipp ipp/2 0 i tp = 40ms t impulse n5 vs (v) 66.5 vbat (v) 13.5 ri ( w )2 t (ms) 200 (*) tr (ms) <10 number 5 60s between each pulse (*) generator setting 1) with open circuit (generator is in open circuit): - calibrate vs 2) with short circuit (generator is in short circuit): - calibrate ri (ri = 2 w ) 3) with d.u.t. - calibrate tp (tp = 40ms @ ipp/2) typ. vpp v bat 20ms/div. 10.0v/div. typical voltage curve (open circuit) typ. vcl ipp 20ms/div. 5.0v/div. 20ms/div. 3a/div. typical voltage and current curve with d.u.t. calibration method for schaffner nsg 506 c a RBO40-40G / rbo40-40m / rbo40-40t 6/15
1 2 5 10 20 50 100 0.1 0.2 0.5 1.0 2.0 5.0 10.0 transil t1 transil t2 t p (ms) ppp(kw) fig. 1 : peak pulse power versus exponential pulse duration (tj initial = 85c). v (v) cl 1 2 5 10 20 50 100 200 500 25 30 35 40 45 50 55 t p=1ms tp = 20s i p p ( a) fig. 2-2 : clamping voltage versus peak pulse current (tj initial = 85c). exponential waveform tp = 1 ms and tp = 20 m s (transil t1). 0.1 0.2 0.5 1 2 5 10 20 50 100 30.0 32.5 35.0 37.5 40.0 42.5 45.0 tp = 40ms tp = 1ms i pp (a) v (v) cl fig. 2-1 : clamping voltage versus peak pulse current (tj initial = 85c). exponential waveform tp = 40 ms and tp = 1 ms (transil t2). 0 25 50 75 100 125 150 175 0.00 0.20 0.40 0.60 0.80 1.00 1.20 tj initial (c) ppp[tj]/ppp[tj initial=85c] fig. 3 : relative variation of peak pulse power versus junction temperature. a RBO40-40G / rbo40-40m / rbo40-40t 7/15
1e-3 1e-2 1e-1 1e+0 1e+1 0.1 0.2 0.5 1.0 zth(j-c)/rth(j-c) tp (s) fig. 4 : relative variation of thermal impedance junction to case versus pulse duration. 0.1 0.2 0.5 12 5 10 20 50 100 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 v fm (v) tj = 25 c tj = 150 c i fm (a) fig. 5-1 : peak forward voltage drop versus peak forward current (typical values) - (transil t2). 0.1 0.2 0.5 2 10 20 50 100 0.5 1.0 1.5 2.0 2.5 3.0 3.5 v fm (v) 0.1 0.2 0.5 1 5 20 50 100 0.5 1.0 1.5 2.0 2.5 3.0 3.5 tj = 25 c tj = 150 c i fm (a) fig. 5-2 : peak forward voltage drop versus peak forward current (typical values) - (diode d1). ordering information rbo 40 - 40 m reversed battery & overvoltage protection i f(av) = 40 a package : m = powerso-10 g = d 2 pak t = to220ab v cl = 40v fig. 6 : relative variation of leakage current versus junction temperature. a RBO40-40G / rbo40-40m / rbo40-40t 8/15
package mechanical data d 2 pak plastic a c2 d r 2.0 min. flat zone a2 v2 c a1 g l l3 l2 b b2 e ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.30 4.60 0.169 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.40 0.055 c 0.45 0.60 0.017 0.024 c2 1.21 1.36 0.047 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.28 0.393 0.405 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 r 0.40 0.016 v2 0 8 0 8 foot-print d 2 pak 8.90 3.70 1.30 5.08 16.90 10.30 a RBO40-40G / rbo40-40m / rbo40-40t 9/15
soldering recommendation the soldering process causes considerable thermal stress to a semiconductor component. this has to be minimized to assure a reliable and extended lifetime of the device. the powerso-10 package can be exposed to a maximum temperature of 260c for 10 seconds. however a proper soldering of the package could be done at 215c for 3 seconds. any solder temperature profile should be within these limits. as reflow techniques are most common in surface mounting, typical heating profiles are given in figure 1,either for mounting on fr4 or on metal-backed boards. for each particular board, the appropriate heat profile has to be adjusted experimentally. the present proposal is just a starting point. in any case, the following precautions have to be considered : - always preheat the device - peak temperature should be at least 30 c higher than the melting point of the solder alloy chosen - thermal capacity of the base substrate voids pose a difficult reliability problem for large surface mount devices. such voids under the package result in poor thermal contact and the high thermal resistance leads to component failures. the powerso-10 is designed from scratch to be solely a surface mount package, hence symmetry in the x- and y-axis gives the package excellent weight balance. moreover, the powerso-10 offers the unique possibility to control easily the flatness and quality of the soldering process. both the top and the bottom soldered edges of the package are accessible for visual inspection (soldering meniscus). coplanarity between the substrate and the package can be easily verified. the quality of the solder joints is very important for two reasons : (i) poor quality solder joints result directly in poor reliability and (ii) solder thickness affects the thermal resistance significantly. thus a tight control of this parameter results in thermally efficient and reliable solder joints. fig. 1 : typical reflow soldering heat profile time (s) temperature ( c) 0 40 80 120 160 200 240 280 320 360 0 50 100 150 200 250 o 215 c o soldering preheating cooling 245 c o epoxy fr4 board metal-backed board a RBO40-40G / rbo40-40m / rbo40-40t 10/15
substrates and mounting information the use of epoxy fr4 boards is quite common for surface mounting techniques, however, their poor thermal conduction compromises the otherwise outstanding thermal performance of the powerso-10. some methods to overcome this limitation are discussed below. one possibility to improve the thermal conduction is the use of large heat spreader areas at the copper layer of the pc board. this leads to a reduction of thermal resistance to 35 c for 6 cm 2 of the board heatsink (see fig. 2). use of copper-filled through holes on conventional fr4 techniques will increase the metallization and decrease thermal resistance accordingly. using a configuration with 16 holes under the spreader of the package with a pitch of 1.8 mm and a diameter of 0.7 mm, the thermal resistance (junction - heatsink) can be reduced to 12c/w (see fig. 3). beside the thermal advantage, this solution allows multi-layer boards to be used. however, a drawback of this traditional material prevents its use in very high power, high current circuits. for instance, it is not advisable to surface mount devices with currents greater than 10 a on fr4 boards. a power mosfet or schottky diode in a surface mount power package can handle up to around 50 a if better substrates are used. fig. 2 : mounting on epoxy fr4 head dissipation by extending the area of the copper layer fig. 3 : mounting on epoxy fr4 by using copper-filled through holes for heat transfer fr4 board copper foil fr4 board copper foil heat transfer heatsink a RBO40-40G / rbo40-40m / rbo40-40t 11/15
powerso-10 package mounted on r th (j-a) p diss 1.fr4 using the recommended pad-layout 50 c/w 1.5 w 2.fr4 with heatsink on board (6cm 2 ) 35 c/w 2.0 w 3.fr4 with copper-filled through holes and external heatsink applied 12 c/w 5.8 w 4. ims floating in air (40 cm 2 ) 8 c/w 8.8 w 5. ims with external heatsink applied 3.5 c/w 20 w table 1 a new technology available today is ims - an insulated metallic substrate. this offers greatly enhanced thermal characteristics for surface mount components. ims is a substrate consisting of three different layers, (i) the base material which is available as an aluminium or a copper plate, (ii) a thermal conductive dielectrical layer and (iii) a copper foil, which can be etched as a circuit layer. using this material a thermal resistance of 8c/w with 40 cm 2 of board floating in air is achievable (see fig. 4). if even higher power is to be dissipated an external heatsink could be applied which leads to an r th (j-a) of 3.5c/w (see fig. 5), assuming that r th (heatsink-air) is equal to r th (junction-heatsink). this is commonly applied in practice, leading to reasonable heatsink dimensions. often power devices are defined by considering the maximum junction temperature of the device. in practice , however, this is far from being exploited. a summary of various power management capabilities is made in table 1 based on a reasonable delta t of 70c junction to air. the powerso-10 concept also represents an attractive alternative to c.o.b. techniques. powerso-10 offers devices fully tested at low and high temperature. mounting is simple - only conventional smt is required - enabling the users to get rid of bond wire problems and the problem to control the high temperature soft soldering as well. an optimized thermal management is guaranteed through powerso-10 as the power chips must in any case be mounted on heat spreaders before being mounted onto the substrate. fig. 4 : mounting on metal backed board fig. 5 : mounting on metal backed board with an external heatsink applied fr4 board copper foil aluminium heatsink copper foil insulation aluminium a RBO40-40G / rbo40-40m / rbo40-40t 12/15
package mechanical data e2 e 1 10 5 6 h eb 0.25 m d h a f a1 e4 e3 e1 se ati ng plane se ating pl ane a b c q detail "a" 0.10 a b l a1 a detail "a" d1 ref. dimensions millimeters inches min. typ. max. min. typ. max. a 3.35 3.65 0.131 0.143 a1 0.00 0.10 0.00 0.0039 b 0.40 0.60 0.0157 0.0236 c 0.35 0.55 0.0137 0.0217 d 9.40 9.60 0.370 0.378 d1 7.40 7.60 0.291 0.299 e 9.30 9.50 0.366 0.374 e1 7.20 7.40 0.283 0.291 e2 7.20 7.60 0.283 0.299 ref. dimensions millimeters inches min. typ. max. min. typ. max. e3 6.10 6.35 0.240 0.250 e4 5.90 6.10 0.232 0.240 e 1.27 0.05 f 1.25 1.35 0.0492 0.0531 h 13.80 14.40 0.543 0.567 h0.50 0.019 l 1.20 1.80 0.0472 0.0708 q1.70 0.067 a0 80 8 a RBO40-40G / rbo40-40m / rbo40-40t 13/15
header shape foot print mounting pad layout recommended shipping tube dimensions (mm) typ a b c length tube 18 12 0,8 532 quantity per tube 50 dimensions in millimeters dimensions in millimeters surface mount film taping : contact sales office b c a a RBO40-40G / rbo40-40m / rbo40-40t 14/15
package mechanical data to220ab plastic ref. dimensions millimeters inches min. max. min. max. a 14.23 15.87 0.560 0.625 a1 4.50 0.177 a2 12.70 14.70 0.500 0.579 b 10.20 10.45 0.402 0.411 b1 0.64 0.96 0.025 0.038 b2 1.15 1.39 0.045 0.055 c 4.48 4.82 0.176 0.190 c1 0.35 0.65 0.020 0.026 c2 2.10 2.70 0.083 0.106 e 2.29 2.79 0.090 0.110 f 5.85 6.85 0.230 0.270 i 3.55 4.00 0.140 0.157 l 2.54 3.00 0.100 0.118 l2 1.45 1.75 0.057 0.069 l3 0.80 1.20 0.031 0.047 information furnished is believed to be accurate and reliable. however, sgs-thomson microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result f rom its use. no license is granted by implication or otherwise under any patent or patent rights of sgs-thomson microelectronics. specification s mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously s upplied. sgs-thomson microelectronics products are not authorized for use as critical components in life support devices or systems with out express written approval of sgs-thomson microelectronics. ? 1997 sgs-thomson microelectronics - printed in italy - all rights reserved. sgs-thomson microelectronics group of companies australia - brazil - canada - china - france - germany - italy - japan - korea - malaysia - malta - morocco the netherlands - singapore - spain - sweden - switzerland - taiwan - thailand - united kingdom - u.s.a. a RBO40-40G / rbo40-40m / rbo40-40t 15/15

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